Application Abstract: The main contents of this research project include:1in-situ testing technology of mechanical properties of chips and packages under high and low temperatures and different vacuum degrees;2In-situ testing technology for thermal characteristics of chips and packages;3In-situ testing technology of mechanical-electrical coupling characteristics of micro-nano sensing structures to realize the synchronous extraction of micro-mechanical-electrical parameters.4On-chip characterization structure design and testing technology,aiming at the problems of microstructure modal splitting and stress caused by the mismatch of microdevice materials and structures,a"on-chip testing machine"is designed to characterize the characteristics of materials,structures and processes,so as to realize the amplification of structural stress and packaging residual stress or deformation and the test and extraction of characteristic parameters.
