NRI/Collaborative Research:Robotic Disassembly of High-Precision Electronic Devices
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1.AI-driven fringe restoration for overexposed condition using a GAN-based framework
- 关键词:
- 3D reconstruction;Contour measurement;Frequency domain analysis;Image reconstruction;Interferometry;Optical projectors;Profilometry;Projection systems;Restoration;Adversarial networks;Condition;Fourier;Frequency domains;Fringe pattern;Fringe projection profilometry;Highly reflective;Overexposure compensation;Phase information;Reflective surfaces
- Cheng, Yang;Li, Beiwen
- 《6th Applied Optical Metrology》
- 2025年
- August 4, 2025 - August 6, 2025
- San Diego, CA, United states
- 会议
Fringe projection profilometry (FPP) is prone to overexposure when scanning highly reflective surfaces, causing fringe saturation and loss of phase information. We propose FDCGAN, a frequency-domain constrained GAN that restores saturated fringe patterns by designing frequency-aware networks with Fourier-based loss functions. Trained on synthetic data and fine-tuned with real measurements, FDCGAN achieves superior performance in fringe recovery and 3D reconstruction under extreme exposure. The method is practical for industrial and biomedical FPP applications facing challenging lighting conditions. © COPYRIGHT SPIE. Downloading of the abstract is permitted for personal use only.
...2.SINGLE SHOT 3D SHAPE MEASUREMENT OF NON-VOLATILE DATA STORAGE DEVICES
- 关键词:
- Computer aided design;Deep learning;Municipal solid waste;Recycling;Robotics;Three dimensional computer graphics;Virtual storage;3-d shape measurement;Data storage devices;Electronics wastes;Fringe images;Fringe projection profilometry;Hard disc;High-accuracy;Measurements of;Non-volatile data;Single-shot
- Balasubramaniam, Badrinath;Li, Beiwen
- 《ASME 2023 18th International Manufacturing Science and Engineering Conference, MSEC 2023》
- 2023年
- June 12, 2023 - June 16, 2023
- New Brunswick, NJ, United states
- 会议
The value of electronic waste at present is estimated to increase rapidly year after year, and with rapid advances in electronics, shows no signs of slowing down. Storage devices such as SATA Hard Disks and Solid State Devices are electronic devices with high value recyclable raw materials which often goes unrecovered. Most of the e-waste currently generated, including HDDs, is either managed by the informal recycling sector, or is improperly landfilled with the municipal solid waste, primarily due to insufficient recovery infrastructure and labor shortage in the recycling industry. This emphasizes the importance of developing modern advanced recycling technologies such as robotic disassembly. Performing smooth robotic disassembly operations of precision electronics necessitates fast and accurate geometric 3D profiling to provide a quick and precise location of key components. Fringe Projection Profilometry (FPP), as a variation of the well-known structured light technology, provides both the high speed and high accuracy needed to accomplish this. However, Using FPP for disassembly of high-precision electronics such as hard disks can be especially challenging, given that the hard disk platter is almost completely reflective. Furthermore, the metallic nature of its various components make it difficult to render an accurate 3D reconstruction. To address this challenge, We have developed a single-shot approach to predict the 3D point cloud of these devices using a combination of computer graphics, fringe projection, and deep learning. We calibrate a physical FPP-based 3D shape measurement system and set up its digital twin using computer graphics. We capture HDD and SSD CAD models at various orientations to generate virtual training datasets consisting of fringe images and their point cloud reconstructions. This is used to train the U-NET which is then found efficient to predict the depth of the parts to a high accuracy with only a single shot fringe image. This proposed technology has the potential to serve as a valuable fast 3D vision tool for robotic re-manufacturing and is a stepping stone for building a completely automated assembly system. Copyright © 2023 by ASME.
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