サブテラヘルツ電磁波利用を拓く高出力・高集積z軸集積回路の設計試作学術基盤の構築

项目来源

日本学术振兴会基金(JSPS)

项目主持人

三田 吉郎

项目受资助机构

東京大学

项目编号

24H00307

立项年度

2024

立项时间

未公开

项目级别

国家级

研究期限

未知 / 未知

受资助金额

48100000.00日元

学科

電気電子工学およびその関連分野

学科代码

未公开

基金类别

基盤研究(A)

关键词

テラヘルツ応用 ; CMOS-MEMS ; チップレット ; 三次元集積回路 ;

参与者

高野恭弥

参与机构

東京大学,大学院工学系研究科;東京理科大学,創域理工学部電気電子情報工学科

项目标书摘要:Outline of · · · Start:サブテラヘルツは人類に残された最後の電磁波領域である。電子回路によって制御できれば、光学的手法と比較して極めてコンパクト、かつ振幅と位相を利用する伝統的無線回路技術の豊富な蓄積を活用したシステムを実現できる。最新技術の課題「弱い送信電力(10mW程度)」を100倍(Wクラス)にまで高める手法の構築を目標とし、実現のためにLSIチップのz軸(面外)方向を効果的に活用した回路集積のための新微細加工プロセス・デバイス技術を創出する。研究成果としてプロセス開発キット(PDK)および、LSIファウンドリ並びにオープンプラットフォームを通じたデバイス試作のワークフローを得、研究者コミュニティを形成する。

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  • 1.Th···y ··· E···ri···ta···em···tr···on··· S···et···al···Bi···bl···EM···in···in···uc···d ···m

    • 关键词:
    • Force; Micromechanical devices; Deformation; Springs; Bending;Microelectromechanical systems; Fabrication; Switches; Pins; Imagecoding; Buckling; bistable; MEMS; mechanical memory;FULLY COMPLIANT; MICROMECHANISMS; SWITCH
    • Ya···ag···Sh···Ez···, ···oh···;M···, ···hi·
    • 《JO···AL··· M···OE···TR···CH···CA···YS···S》
    • 2025年
    • 期刊

    In···an···ov··· M··· b···ab···el···nt···it···ym···ri··· s···le···at···ca···e ···li··· u···g ···t-···ce···co···es···n ···a ···ai··· b··· t···e ···e ···kl···Th···pa··· d···ve···nd···pe···en···ly···mo···ra··· a···na···ic···th···y ···th···el···nt···es··· p···me···s ···th···om···en···tr···ur··· a···ck···g ···m,···pp···in···rm···an···om···ss··· m···an···s ···h ···ec···ac···th···ca···e ···e ···xi··· a···re···ed··· t···be···io···nc···in···he···am···pr···le···he···rc···eq···ed··· m··· a···ip··· t···ot··· s···e,···d ··· d···la···en···he···th···li···ap···s.···st···vi··· w··· f···ic···d ···ng···e ···ic···on···su···or···MS···ch···ue···d ···ir···sp···e ···an···ec···st···c ···ra···on···s ···su···. ··· e···ri···ta···es···s ···ch···th···ev···pe···he···. ··· t···ry···d ··· e···ri···ta···es···s ···se···d ···th···pa··· c···fa···it··· t···in···du···on··· s···et···al···st···e ···uc···es··· a···w ···ha···al···em··· i···ut··· M··· d···ce···[2···-0···]

    ...
  • 2.A ···on···at··· o···na···/D···ta···on···te···re···es···oi···om···in···si···a ···ie···on···te···es···ti···Sw···he···EM···ou···r

    • 关键词:
    • Analog to digital conversion;Energy efficiency;Green computing;Learning algorithms;Learning systems;Oscillators (mechanical);Resonators;Analog-digital converter;Analogue-digital converters;Computing system;Edge computing;Energy-efficient machine;MEMS resonators;MEMS switches;Physical reservoir computing;Reservoir Computing;Series-connected
    • Yo···da···ki···o;···an···Ry···o;···un···, ···n;···o,···io···ta···os···
    • 《23···In···na···na···on···en···on···li···ta···Se···rs···ct···or···nd···cr···st···, ···ns···er···02·》
    • 2025年
    • June 29, 2025 - July 3, 2025
    • Or···do···L,···it···st···s
    • 会议

    Th···pa··· p···os···a ···er···r ···pu···g ···te···ha···ti···es···e ···am··· o···er···-c···ec··· r···na···s,···wa···th···mp···en···io···f ···rg···ff···en···ac···e-···rn··· i···rm···on···oc···in···Th···sc···at···s ···ha···al···ar···er···ic···yn···ca··· c···ge··· r···on···to···te···l ···na···np···as···su···ra···bi···vo···ge···nd···co···ct···it···eq···pe···n ···h ···on···r ···ec···a ···ge···sp···em··· e···ed··· t···in···al···p.···e ···te···im··· c···ts···e ···ta···in···ti···te···t ···h ···on···r ···th···es···oi···ut···. ···ng···e ···ig··· d···ce···es···oi···om···in···it···wo···pe···f ···ch···k ···ks···s ···er···nt···y ···on···at··· c···rl···ho···g ···t ··· c···in···on··· o···de···e ··· r···ou···et··· e···ct···ly···tr···s ···e-···ie···nf···at··· u···ul···r ···pu···g.···e ···ll···ot···nt···d ···pl···ea···t ···ho···th···ee···or···al···pe···he··· c···ui···co···ib··· t···ra···ca···dg···om···in···© ···5 ···E.

    ...
  • 3.Pa···ve···d ···sa···od···ng··· 3···GH···an···C ···ac···rs···in···at···al···ly···ia···pp···im···on

    • 关键词:
    • BiCMOS technology;Bismuth alloys;Circuit simulation;Equivalent circuits;MOS devices;Polynomial approximation;Timing circuits;300-GHz-band;Causal modeling;GHz band;Metal-oxide;Modeling;Oxide metals;Passive component;Rational polynomial;Rational polynomial approximation;Sige BiCMOS
    • Be···, ···n;···ay···, ···o;···a,···in···e;···am···u,···if···;M···, ···hi···ka··· K···a
    • 《37···IE···In···na···na···on···en···on···cr···ec···ni···es···tr···ur··· I···S ···5》
    • 2025年
    • March 24, 2024 - March 27, 2024
    • Sa···nt···o,···, ···te···ta···
    • 会议

    Th···re···rc···re···ts···me···d ···mo··· m···l-···de···ta···MO···ca···it··· f···30···Hz···nd···pl···ti··· u···g ···io··· p···no···l ···ro···at··· (···).···il···ni···l ···ro···at···s ···en···ad··· n···ti···el···nt···lu···du···o ···su···en···rr···, ··· m···l ···re···in···by···-f···in···it···es···ct···s ···en···e ···si···y ··· c···al···. ···s ···ro··· p···uc···ac···at···qu···le···ci···it···ui···le···r ···h-···qu···y ···ul···on···Th···et··· w···va···at···wi···me···re···t ···h ···t ···uc···e ···p ···ri···ed···th···13··· S··· B···OS···oc···. ···02···EE··

    ...
  • 4.Es···at··· V···ic···ty···ra···er···n ···p ···ct··· I···Et···ng···in···EM···sc···at···

    • 关键词:
    • Nanotechnology;Parameter estimation;Cross section;Cross-section area;Deep Reactive Ion Etching;Deep reactive-ion etchings;MEMS Oscillators;Resonance frequencies;Second moments;Test-structure;Underetch;Vertical profile
    • Ya···ag···Sh···Mi··· Y···io
    • 《37···IE···In···na···na···on···en···on···cr···ec···ni···es···tr···ur··· I···S ···5》
    • 2025年
    • March 24, 2024 - March 27, 2024
    • Sa···nt···o,···, ···te···ta···
    • 会议

    In···ew··· c···ac···iz··· a···rt···l ···fi···of···ep···ac···e ··· e···in···DR··· w···ou···ak··· a···os···ec···n,··· p···os··· m···od··· e···ma···re···se···ti···pa···et···, ···el···th···nd···tc··· c···s-···ti···ar···an···he···co···mo···t ···ar··· T···te···st···tu···co···st···f ···er··· o···EM···sc···at···, ··· r···na··· f···ue··· o···hi···wa···lo···d ··· v···ed···ri···st···ne···an···it··· t··· p···ic···mo··· d···ve···ro···eo···ry···he···ti···io···ro···sc···at··· m···ur···nt···s ···pa··· t···he···tu···pr···le···ra···er···bt···ed···om···su···ob···va···n,···ow··· c···el···on···=0···6 ··· 0···3 ··· t···un···et···ar···an···he···co···mo···t ···ar··· r···ec···el···© ···5 ···E.

    ...
  • 5.He···ta··· M··· S···e

    • 关键词:
    • Buckling behavior;Displacement control;Position control;Bistable elements;Bistables;Buckled beams;MEMS stage;Microstage;Multistable;Pin joints;Rigid rods;Stable Configuration;Two ways
    • Ya···ag···Sh···Mi··· Y···io
    • 《23···In···na···na···on···en···on···li···ta···Se···rs···ct···or···nd···cr···st···, ···ns···er···02·》
    • 2025年
    • June 29, 2025 - July 3, 2025
    • Or···do···L,···it···st···s
    • 会议

    We···po···on··· i···la···mo···g,···an···ti···l ··· r···ry···cr···ag···it···ix···ab···co···gu···io··· F··· w··· o···ra···at··· w···ou···ot···on···d ··· w··· o···ot···on···th··· t···sl···on···ou···is···le···em···s ···t ···li···a ···kl···be···ar···on···te···o ··· s···e ···pi···oi···ri··· r···, ···li···g ···fe···t ···ge···st···s ···th···om···at··· o···he···ck···g ···te···Th···ev··· f···ic···d ···a ···ic···on···su···or···ip···mo···ra··· t···si···ta··· c···ig···ti··· a···th··· t···si···n ···el···ri··· a···at···. ··· d···ce···n ···ef···fr···co···ol··· d···la···en···el···it···t ···er··· e···gy···pp··· f···li···in···pp···un···es···r ··· p···r ···su···io···pp···at···s.···20···IE···

    ...
  • 6.Ad···ta···an···ha···ng···f ···ct···al···it···l ···en···n ···t ···uc···es···r ···ct···la··· H··· A···ct···ti···an···tr···ur···(H···S)··· I···la···g ···er···s

    • 关键词:
    • Aspect ratio;Conductive materials;Fiber optic sensors;Insulating materials;Insulation;Solid-state sensors;Conductive layer;Electrical critical dimension;Electrical critical dimensions;Electro-mechanical;High aspect ratio nano-structures;Mechanical structures;Metallics;Scanning electrons;Submicron;Test-structure
    • Mi··· Y···io···zu···ma···ya···Ka···, ···ik···hi···, ···bo···no··· Y···e;···a,···su···Ya···ag···Sh···Na···e,···os···Bo···ie···Da···;B···er··· A···;G···ie···Hu···s;···o,···io
    • 《37···IE···In···na···na···on···en···on···cr···ec···ni···es···tr···ur··· I···S ···5》
    • 2025年
    • March 24, 2024 - March 27, 2024
    • Sa···nt···o,···, ···te···ta···
    • 会议

    El···ri··· C···ic···Di···si···Te···St···tu··· (···-T···ha···be···ap···ed···r ···el···en···f ··· t···no···y:···ta···c ···h ···ec···at···Na···St···tu··· (···al···RN··· T···HA··· r···r ···el···ro···ch···ca···tr···ur···sc···d ···n ···su···cr···wi··· (···na···w ···26··· c···ir···) ···le···ep··· i···th···ne···(u···o ···0n···on···me··· T···ma··· a···nt··· a···ch···en···ha···be···co···rm···th···gh···as···me··· (···in···at··· m···ri···sh···d ···ti··· a···nt··· o···CD···er···an···g ···ct··· M···os···e ···as···sm··· a···(2···ee···on···ti···la··· a···ct···th···ea···em··· a···ea···e ···h.···20···IE···

    ...
  • 7.Pr···am···le···nn···ed··· N···or···f ···ta··· E···en···fo···em···si···Ma···ne

    • 关键词:
    • Microchannels;MOEMS;2d connected bistable element;Asymmetry;Bistable elements;Bistable structures;Ising machine;Micro-electro-mechanical;Microelectromechanical system ising machine;Post process;Programmability
    • Ya···ag···Sh···Ez···, ···oh···;M···, ···hi·
    • 《38···IE···In···na···na···on···en···on···cr···le···o ···ha···al···st···, ···S ···5》
    • 2025年
    • January 19, 2025 - January 23, 2025
    • Ka···iu··· T···an
    • 会议

    We···op··· a···st···oc··· a···st···e ···mm···ic···bi···bl···tr···ur···or···cr···ec···me···ni··· s···em···ME··· I···g ···hi···wi···pr···am···il··· a···2D···tw··· c···ec···it···Tw···at···me···ni··· s···ct···ly···or··· t···di···nc···et···n ···uc···d ···m ···sy···tr···l ···ta··· p···nt··· a···it···up···ti···ar··· c···in··· b··· f···e ···re···ze···ym···ri··· f···pi···be···io···Th···ab···at···de···e,···ic···e ···ay···in···3×···on···te···et···k ···de···st···io···sh···d ···wi···as···et···as···e ···rt···ng···st···e ···re···d.···ff···nt···ha···rs··· r···on···to···e ···e ···ta···in··· w··· o···rv···fo···if···en··· b···ed···vi···. ···se···at···s ···l ···th···na···rs···r ···ct···l ···S ···ng···ch···s.···20···IE···

    ...
  • 8.A ···GH···op···gi··· E···tr···l ···cu···Us··· I···rc··· M···al···du···nc···ab···at···By···al···ma···ne···oc···

    • 关键词:
    • 5G mobile communication systems;Chemical reactions;Chip scale packages;Electric network parameters;Electric network topology;Energy conversion;Energy transfer;Flip chip devices;Inductive power transmission;Magnetic couplings ;Microwave circuits;Network topology;Timing circuits;5g/6g wireless communication technology;Copper wiring;Dual damascene;Dual damascene process;Electrical circuit;Mutual inductance;Power transfers;Topological electrical circuit;Wireless communication technology;Wireless power
    • Ta···as··· R···ei···su···a,···un···zu··· T···uy···ig···Ak··
    • 《23···In···na···na···on···en···on···li···ta···Se···rs···ct···or···nd···cr···st···, ···ns···er···02·》
    • 2025年
    • June 29, 2025 - July 3, 2025
    • Or···do···L,···it···st···s
    • 会议

    A ···ol···ca···le···ic···ci···it···pl···ng···tu···in···ta···, ···ch···so···es··· 1··· G···(K···an··· i···em···tr···d ··· t···fi··· t···. ···h ··· s··· c···ui···tr···ur···it···hi···s ···ri···l ···te··· u···g ···fe···t ···cu···pa···et···. ··· c···ui···ar···om···ed··· c···er···ri···an···ab···at···by···du···da···ce···pr···ss···li···hi···on···g ···ap···ed··· a···ev···tr··· m···et···co···in···y ···uc··· t···la···al···st···e ···we···in···to···fa···ca··· o··· d···er··· t···di··· T···mi···fa···ca···n ···hn···e ···h ··· c···er···ri··· r···iz···th···ig··· r···na··· f···ue··· a···lo···ir··· r···st···e,···ic···il···pe···he···y ··· a···de···ri··· o···pp···at···s ···to···og···l ···ct···ic···su···as···/6···ir···ss···mm···ca···ns···d ···el···-p···r-···ns··· s···em···© ···5 ···E.

    ...
  • 9.Wa···en···-S···ct··· W···gu··· P···od···ct···Ut···zi···Su···ce···as··· R···na···

    • 关键词:
    • Electrodes;Optical interconnects;Optical waveguides;Photonic devices;Photonic integrated circuits;Photonic integration technology;Photons;Plasmonics;Silicon photonics;Surface plasmon resonance ;Transparent optical networks;Fabricated device;Silicon based photonics;Silicon photonic integrated circuits;Silicon waveguide;Silicon wire waveguides;Surface-plasmon resonance;Waveguide photodetectors;Wavelength Selectivity;Wavelength-selective;Wavelength-selective photodetector
    • Ma···wa···ok···as···ga···hu···ak···, ···sh···it···Yo···o;···o,···io
    • 《20···Sy···si···on···si··· T···, ···eg···io···nd···ck···ng··· M···/M···S,···IP···25》
    • 2025年
    • June 1, 2025 - June 4, 2025
    • Sp···, ···at··
    • 会议

    As···li···-b···d ···to··· i···gr···d ···cu··· (···s)···va··· t···rd···rg···ca···in···ra···n ··· m···i-···el···th···er···on···he···is···gr···ng···ed···r ···to···ec···s ···t ···bl···he···ca···il···es···n ···s ···dy···e ···po···a ···el···th···le···ve···ot···te···r ···eg···ed···th···si···on···ve···de··· u···iz··· s···ac···la···n ···it···on···he···vi···fe···re···om···ha··· e···tr···s ···te···d ···a ···ic···wa···ui··· w···h ···il···te···as···ic···ci···io···nd···ad··· v···at··· i···he···ot···te···r'···av···ng···se···ti···y.··· t···ng···e ···e ···th···le···od··· t···wa···en···-d···nd··· r···on···ca···e ···us···. ··· f···ic···d ···ic···as···al···ed···ro··· p···oc···en···ea···em···s ···er···le···mu···at··· w···le···hs···om···80··· t···63···m.···as···me···re···ts··· t···fa···ca··· d···ce···nf···ed···at···e ···to···ec···n ···ab···ty··· t···pr···se···tr···ur···xh···te···is···ct···ve···gt···el···iv··· d···nd··· o···he···ec···de···nf···ra···ns···he···re···ts···ov··· i···gh···in···th···ev···pm··· o···av···ng···se···ti···ph···de···to···an···ol···ot···ia···or···pl···ti··· i···pt···l ···er···ne··· a···ph···ni···eu··· n···or··· ©···25···EE·

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