数字···射频···波集···技术

项目来源

国家···发计···KR··

项目主持人

周健·

项目受资助机构

广州···信集···有限··

立项年度

2019

立项时间

未公开

项目编号

20···FB···46··

研究期限

未知 / 未知

项目级别

国家·

受资助金额

1718.00万元

学科

光电···电子···集成

学科代码

未公开

基金类别

未公开

关键词

融合···AI···带高···线极···工天···成高···双工···小型···感知···;6···z ···O ···W雷···频率···线性···MC···测距···分辨··

英文关键词

Fu···n ···p;···ad···d ···h ···la···n ···li···r ···ar···ti···fu···du···x ···en···of···P;···in···ur···d ···ar···ns··· m···os···em···th···te···te···ig···so···io···ul···up··· a···nn···0G···MI···FM···ra···;F···ue··· s···e ···li···ri···LF··· r···r ···gi···ac···ac···nd···so···io··

参与者

胡晓···昌展···;

参与机构

上海···学;

项目标书摘要:20···度,···队围···科研···展了···面的···作,···的成···到年···任务···具体···任务···归纳···_x···D_···片方···合芯···成顶···与芯···设计···通信···、雷···功能···仿真···确,···在流···中。···00···频段···融合···多功···系统···面:···一种···感通···背景···于A···宽带···同线···时同···工天···出了···IM···MC···接收···态配···法。···实现···收信···噪比···,在···景中···超过···B的···度提···而提···达角···和目···的准···提出···新的···有关···率模···个新···距有···度模···出了···的设···,可···受频···非线···的低···束雷···计。···00···合样···试平···方面···成基···芯片···、导···达功···机设···试,···能能···目需···于融···设计···是在···用芯···的样···上进···改进···前已···机的···原理···,待···片设···成功···进行···计。···起支···、导···达功···验证···平台···毫米···场系···。

In···23···e ···en···ic···se···h ···m ···ri···ou···es···ch···rk··· r···te···sp···s ···un···he···nu···sc···ti··· r···ar···ta···an···he···hi···me··· a···ev···ha···me···he···qu···me··· o···he···nu···sc···ti··· r···ar···ta···Th···pe···ic···sk···om···te···re···mm···ze···s ···lo···_x···D_···io···hi···he···si···ch···ha···om···te···he···p-···el···an···g ··· c··· l···ut···si···in···di···th··· f···ti···l ···ul···of···mm···ca···n,···ig···on···d ···ar···ic···av···ee···er···ed···rr···ly··· s···la···n ··· a···cu···nt···in···e ···ue··· s···am··· c···s.···00···n ···ms··· m···i-···d ···ti···nc···n ···io···nt···a ··· m···i-···ct··· f···on···st···op···iz···on···wi···an···ig···so···io···o-···ar···ti···si···ta···us···ll···pl···an···na···se···n ··· i···es···ed···de···he···ck···un···f ···se···an··· i···gr···on···dy···ic···nf···ra···n ···ho···or···ce···ng···an··· o···IM···MC···ad···is···op···d.···s ···ho···an···pr··· t···si···l-···no··· r···o ···th···ec···ed···fo···ti···an···he···gn···st···gt···f ···e ···n ···B ···va···us···en···th···im···vi···th···cc···cy··· a···va···ng···es···at··· a···ta···t ···at···.A···w ···ge···la··· r···lu···n ···el···d ···ew···ng···el···d ···ur··· m···l ··· p···os···an··· n···de···n ···ho···s ···po···,w···h ··· g···e ··· d···gn··· l···fr···en···mu···-b··· r···r ···ec··· b···re···nc···lo···no···ne···ty···00···Fu···n ···to···e ··· t··· p···fo···co···ru···on···e ···to···e ···ig···nd···st··· c···un···ti···na···at··· a···ra··· f···ti··· b···d ···co···rc··· c···s ···e ···n ···pl···d,··· t···fu···io··· p···or···ce···n ···t ··· p···ec···eq···em···s.··· p···ot··· b···d ···fu···n ···p ···ig···s ···es··· i···ov···nt···se···n ··· p···ot··· b···d ···co···rc··· c··· d···gn··· p···en···he···he···an···ch···ti···es··· o···he···ot···pe···ve···en···mp···ed···d ··· p···ot··· d···gn···n ···ca···ed···t ···er···e ···io···hi···es··· i···uc···sf···y ···if···.A···st···at···m ··· b··· b···t ···su···rt···e ···ti···an···er···ca···n ···co···ni···io···av···ti···an···ad···fu···io···an···he···ns···ct··· o··· m···im···r ···e ···tr···io···ie···sy···m ··· b··· c···le···.

项目受资助省

广东·

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  • 1.融合···机及···统2···年度···20···An···l ···or···n ···io···hi···ro···yp···nd···mo···ra···n ···te··

    • 关键词:
    • 融合芯片、AIP的宽带高隔离共线极化全双工天线、集成高隔离全双工天线的小型化雷达感知微系统、60GHz MIMO FMCW雷达、t频率斜坡非线性,LFMCW雷达测距精度和分辨率、Fusion chip、Broadband high isolation collinear polarization full duplex antenna of AIP、A miniaturized radar sensing microsystem with integrated high isolation full duplex antenna、60GHz MIMO FMCW radar、Frequency slope nonlinearity,LFMCW radar ranging accuracy and resolution
    • 胡晓东;顾昌展;
    • 《广州海格通信集团股份有限公司;上海交通大学;》
    • 2023年
    • 报告

    20···度,···队围···科研···展了···面的···作,···的成···到年···任务···具体···任务···归纳···_x···D_···片方···合芯···成顶···与芯···设计···通信···、雷···功能···仿真···确,···在流···中。···00···频段···融合···多功···系统···面:···一种···感通···背景···于A···宽带···同线···时同···工天···出了···IM···MC···接收···态配···法。···实现···收信···噪比···,在···景中···超过···B的···度提···而提···达角···和目···的准···提出···新的···有关···率模···个新···距有···度模···出了···的设···,可···受频···非线···的低···束雷···计。···00···合样···试平···方面···成基···芯片···、导···达功···机设···试,···能能···目需···于融···设计···是在···用芯···的样···上进···改进···前已···机的···原理···,待···片设···成功···进行···计。···起支···、导···达功···验证···平台···毫米···场系···。I···02···he···ie···fi···es···ch···am···rr··· o···re···rc···or···n ···at···as···ts···ou···th···nn··· s···nt···c ···ea··· t···,a···th···ch···em···s ···ie··· h··· m···th···eq···em···s ···th···nn··· s···nt···c ···ea··· t···.T···sp···fi···as···co···et···ar···um···iz···as···ll···:_···0D···si···ch···Th···us··· c··· h···co···et···th···op···ve···la···ng···d ···p ···ou···es···,i···ud··· t···e ···ct···al···du··· o···om···ic···on···vi···io···nd···da···hi···ha···be···ve···ie···or···tl···y ···ul···on···d ··· c···en··· i···he···eu···f ···ea···g ···ps···00···In···rm···f ···ti···nd···lt···un···on···si···an···na···d ···ti···nc···n ···io···ys··· o···mi···io··· w···ba···hi···is···ti···co···la···at··· s···lt···ou···ul···up··· a···nn···as···on···P ···de···ne···nd···th···ac···ou···of···ns···ha···l ···eg···io··· d···mi···on···ur···on···th···fo···ec···in···ha···l ···MI···FM···ra··· i···ro···ed···is···th···ca···mp···e ··· s···al···-n···e ···io··· t···re···ve···nf···at··· a···th···ig··· s···ng···of···re···an···dB··· v···ou···ce···,t··· i···ov··· t···ac···ac···f ···iv···An··· e···ma···n ··· t···et···ca···n.···ew···ng···el···d ···ol···on···de···nd···ne···an···re···ed···cu···y ···el···e ···po···,a···a ··· d···gn···th···is···op···d,···ch···n ···de···e ···ig···f ···-f···ue··· m···i-···m ···ar···fe···d ···fr···en···sl··· n···in···it···x0···_F···on···ot···pe···d ···t ···tf··· c···tr···io···he···ot···pe···si···an···es···f ···mu···at···,n···ga···n ··· r···r ···ct···s ···ed··· c···er···l ···ps···ve···en···mp···ed···d ··· f···ti···l ···fo···nc···an···et···e ···je···re···re···ts···e ···to···e ···ed··· f···on···ip···si···is···de···n ···ro···en···as···on···e ···to···e ···ed··· c···er···l ···p ···ig···t ···se···th···ch··· a···sc···at···de···n ···th···ro···yp···av···ee···om···te···nd···e ···to···e ···ig···an··· c···ie···ut···te···he···si···ch···de···n ···su···ss···ly···ri···d.···es···la···rm···s ···n ···lt··· s···or···he···st··· a···ve···ic···on··· c···un···ti···na···at··· a···ra··· f···ti···,a···th···on···uc···n ···a ···li···er···ve···nt···ti···fi··· s···em···s ···n ···pl···d.

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  • 2.数字···/毫···成电···技术···告(···it···Ra··· F···ue···/M···im···r-···e ···eg···ed···rc··· C···on···ty···ch···og···+A···al···po···

    • 关键词:
    • 数字化可重构、串扰、干扰、片上自校准、全数字锁相环、Digitized Reconfiguration、Interference、Crosstalk、On-chip Self-calibration、All Digital Phase-Locked Loops(ADPLL)
    • 陶韦臣;詹毅;郭东辉;林福江;肖文润;伍宇锋;胡诣哲;贺珊;宋佳音;杨武略;
    • 《中国科学技术大学;中国科学院微电子研究所;厦门大学;》
    • 2023年
    • 报告

    随着···合定···的发···于对···位系···度、···功耗···,射···米波···统趋···模态···化、···。本···于射···米波···片研···技术···分别···可重···、干···扰影···、片···准实···频多···字锁···AD···)实···分进···论到···程的···中科···子研···担融···的可···现及···、干···技术···。本···行了···通信···发机···步仿···;基···工收···统搭···应抗···型,···0~···B的···效果···MI···射机···应用···C-···的D···-L··· L···消除···窄带···况下···0d···串扰···果。···担部···现片···准算···发点···宽带···以及···D系···片上···算法···射频···能的···善。···承担···低杂···字锁···AD···)型···合器···究。···完成···PL···再版···及流···,芯···达到···核指···it···he···ve···me···of···lt···od···us··· p···ti···ng···ch···og···nd···e ···th···on···er···on··· t···ac···ac···re···nd···we···on···pt··· o···he···rc···io···os···on··· s···em···e ···mi···me··· w··· p···ti···ng···st···te··· t···e ···ti···de···si···an···nt···at···.B···d ···th···om··· t···ni··· p···le···en···nt···d ···th···us··· c···,t··· r···rt···ab···te···ur···eo···st···es··· r···ar···pr···ss···in···ve···rt···ec···ig···bl···ea···at··· o···he···st···el···na···n ··· i···rf···nc···nd···os···lk···-c··· s···-c···br···on···al···ti···an···mp···en···io··· b···db··· m···i-···e ···-d···ta···ha···lo···d ···p(···LL···x0···__···0D···E ···th···AS··· u···rt···ng···se···h ···th···ec···ig···bl···mp···en···io···f ··· i···cr···ta···in···fe···ce···ti···io···in···e ··· m···i-···e ···io···ys···.D···ng···is···ar··· h··· c···uc··· a···ti···l ···ul···on···d ···t ···na···at··· r···iv···an···om···ic···on···an···iv···.B···on···uc···g ···ad···iv···nt···nt···er···e ···el···se···n ···ul···up··· t···sc···er···st···we···ve···hi···d ···an···in···fe···ce···fe···ra···ng···~3···.B···d ···Mu···pl···np···Mu···pl···ut···(M···)t···sm···er···e ···e ···po··· a···al···op···as···qu···(L···ro···al···li···at··· a···ri··· f···cr···ov···an···ro···al···an···in···ig···l ···-d···or···n(···-D···ar···te···re···mo···ra···g ···is···ba··· e···in···on···fe···of···er··· d···n ···ro···an···ig··· s···ar···.X···en···iv···it···s ···tr···ti···to···e ···ea···,f···si···on···e ···le···ta···n ···on···ip···lf···li···ti···al···it···.T···e ···or···ms···e ···li···to···li···te···d ···an···th···ve···l ···sy···m ···fo···nc···ar···ul···y ···br···ba···tr···ce···rs···d ···D ···te···US···un···ta··· t···st··· o···he···oa···nd···d ···-s···io···AD··· f···ue··· s···he···er···ud···n ··· c···en···ea···e ···e ···pl···d ··· r···si···an···hi···es···g ···th···DP···ch···me···ng···e ···te··· o···he···na···er···ss···me···_x···D_···00·

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  • 3.数字···射频···波集···技术···3年···(2··· A···al···po···on···gi··· I···ns··· R···il···et···Wa···In···ra··· C···ui···ec···lo···

    • 关键词:
    • 通信/导航/雷达多功能融合芯片、多频段协同多波束天线设计、可重构设计、自适应干扰/串扰抵消、融合样机设计、Communication/navigation/radar multifunctional fusion chip、multi-band collaborative multi-beam antenna design、Reconfigurable design、Adaptive interference/crosstalk cancellation、Fusion prototype design
    • 顾昌展;林福江;詹毅;郭东辉;周健军;胡晓东;李智群;
    • 《上海交通大学;中国科学技术大学;中国科学院微电子研究所;厦门大学;广州海格通信集团股份有限公司;东南大学;》
    • 2023年
    • 报告

    本报···介绍···重点···划项···字密···频/···集成···术》···23···术进···项目···进展···为如···。首···频/···融合···性技···完成···构、···校准···/干···应校···,并···型进···,达···目标···PL···电路···真,···心模···O进···片测···足预···。其···信、···分规···层架···括芯···框架···规划···管脚···串行···口(···)配···重点···数字···架构···声宽···机架···多模···航接···行了···对收···链路···模仿···根据···分各···电路···完成···导航···电路···流片···测试···,融···机技···如下···层设···信/···雷达···合的···收发···现M···-相···构复···成毫···段6···z的···线进···真设···工、···性能···明确···寄存···口等···划,···融合···部电···性能···现阶···真结···,融···可保···模块···常工···合样···系统···真测···系统···实现···导航···能。···根据···果进···合通···航/···电路···融合···及演···样机···。T··· r···rt···mm···ze···he···ch···al···og···s ···th···at···al···y ··· p···ec···ig···l ···en···e ···io···eq···cy···ll···te···av···nt···at···Ci···it···ch···og···n ···3.··· t···ni··· p···re···of···is···oj··· i···ai··· d···de···nt···he···ll···ng···rt···x0···_F···tl···n ···ms··· t···co···n ···hn···gy··· R···MW···si···ch···th···od··· o···ec···ig···bl···n-···p ···f-···ib···io···ro···al···da···ve···li···ti···ar···om···te···nd···e ···ul···on···su··· b···d ···th··· m···ls···ve···ac··· t···pr···te···ne···oa···DP···co···et···ci···it···si···an···ap···ut···e ···e ···ul···CO··· m··· t···pr···te···ne···oa···x0···_S···nd···th···om···ic···on···vi···io···nd···da···ar···pl···th···op···ve···rc···ec···e,···lu···g ···p ···ou···la···ng···ip···n ···in···on···d ··· c···ig···ti···et···he···pa··· a··· f···s ···th···tu···of···la···ed···gi··· t···sm···er···ch···ct···,l···no··· b···db··· r···iv···ar···te···re···lt···od···ul···fr···en···na···at··· r···iv···mo···in···nd···mu···io···f ··· t···sc···er···st···an···en···ti···th···ir···t ···ic···rs··· e··· s···mo···e ···or···g ···th···es···s.···pl··· d···gn···pe···t ··· c··· t···in···f ···mu···at···,n···ga···n ··· r···r ···cu···._···0D···ir···,t···de···op···t ···th···om···ic···on···vi···io···ad···mu···fu···io··· f···on···ip···om···e ··· l···l ···as···ll···:r···iz···on··· t···mu···pl···ng···MO···as···ar··· a···it···ur···ro···si···an···es···g ···th···nt···a ···th···il···et···wa···fr···en···ba···ar···ar···d ···;t···to···ev···pl···in···f ··· l···ut···gi···rs···te···ce···s ···pl···d,··· t···in···na···le···om···et···co···ti···it···er···ma··· s···la···n ···th···us··· c··· i···ar···d ···.T···si···at··· r···lt···ho···ha···he···si···ch···ca···ns··· t···no···l ···ra···n ···th···es···ti···mo···e;··· f···on···ot···pe···mo···ra···n ···te···as···al···d ··· b···c ···ct···s ···co···ni···io···nd···vi···io···x0···_T···pr···ct···ll···rt··· i···gr··· t···co···ni···io···av···ti···ra··· s···ci···it···as···on···e ···t ···ul···op···iz···he···si···of···e ···io···hi···nd···e ···to···e ···th···em···tr···on···st···

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  • 4.数字···波收···键技···报告···23···nn··· t···ni··· p···re···re···t ···ke···ec···lo···s ···di···al···ll···te···av···ra···ei···s(···3)·

    • 关键词:
    • CMOS、FMCW 雷达、毫米波、雷达收发机、CMOS、FMCW radar、millimeter wave、radar transceiver
    • 陈雨阳;刘晓鸣;杨照霖;汪胜;金晶;周健军;
    • 《上海交通大学;》
    • 2023年
    • 报告

    本报···了课···数字···波收···键技···20···的技···。课···技术···要包···顶层···雷达···收发···现M···-相···构;···达收···路设···图绘···片测···课题···SM···2n···进行···主要···个部···收机···机与···号发···接收···噪声···NF···8 ···增益···围大···dB···转换···37···dB···1d···点为···dB···射机···dB···为1···dB···和输···为1···m,···36···本振···路实···扫频···扫频···于4···Hz···is···po···in···du··· t···te···ic···pr···es···f ···ic···re···ey···ch···og··· o···ig···l ···li···er···ve···an···iv···in···23···e ···hn···l ···gr··· o···op···th··· m···ly···cl···s ··· f···ow··· p···s.···ig··· m···im···r ···e ···ar···an···iv···an···he···MO···as···ar··· a···it···ur···ro···he···p ···el···mp···e ··· c···ui···es···,l···ut···d ···su···en···f ··· r···r ···ns···ve···he···op···d ···im···me···d ···22··· p···es···nc···es···re···ar···ma···y:···ei···,t···sm···er···d ···qu···y ···th···ze···he···ce···r ···ie··· a···is···ig···(N···f ···s ···n ···,a···st···e ···n ···ge···rg···th···16···a ···im···co···rs··· g··· o···7.···,a···th···np···1d···om···ss··· p···t ···8d···Th···ra···it··· a···ev···an···tp···1d···om···ss··· p···t ···11···Bm···tu···io···ut··· p···r ···14···,a···ga···of···dB···e ···qu···y ···th···ze···s ···ig··· t···ea···e ··· r···r ···qu···y ···ep··· f···ti···wi···th···re···nc···we···ba···id···of···5G···

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