本研···有2···4c···器的···累，···器模···的基···从探···可靠···维护···像质···面考···用模···方式···测器···结构···探测···排列···些挑···测器···增多···了对···温控···要求···器稳···温度···有较···联性···散热···问题···探测···和图···的关···体探···较大···宽度···线散···增大···适的···设计···散射···满足···量的···探测···及整···寸较···量较···其在···5s···需求···尺寸···可靠···个系···稳定···前提···上的···，对···本身···生产···出了···标准···还要···器自···装方···子元···型及···工工···方面···考虑···性与···的要···研究···测器···块化···式实···20···6c···盖，···单元···孔技···用、···列尺···端电···的设···满足···、空···率和···率等···要求···风扇···片和···温度···组成···温度···制系···了系···像质···定性···D ···散射···3D···G)···32···体探···，大···了宽···器自···严重···；探···体和···程的···计，···硬件···、可···；探···体及···构的···计也···探测···的散···。B···d ···th···ec···lo···ac···ul···on··· 2···an···cm···te···rs···is···ud···as···cu··· o···id···od···ov···ge···d ···el···d ··· 1··· d···ct···Ba··· o···he···du···un···of···e ···ec···,c···id···ng···e ···ia···it···ai···in···li···an···ma···qu···ty···e ···ti···er···ra···me···of···de···dy···te···rs···es···s ···e ···ll···es···e ···re··· o···et···or···it···nc···se···he···qu···me··· f···he···di···pa···n ··· t···er···re···nt··· s···em···e ···bi···y ···de···to···as···st···g ···re···io···it···em···at··· s···il···.S···in···he···at···ss···ti···an···em···at··· c···ro···ro···m ···th···ey··· e···re···e ···bi···y ···de···to···nd···ag···he···ra···ca···ri···ra··· o··· w···-b··· d···ct···in···as···wi···a ···ge···ol···at··· w···h,···an···pr···ia···an···sc···er··· d···gn··· n···ed··· r···ce···e ···tt···ng···ti···nd···et···e ···ui···en···of···ag···ua···y.··· d···ct···mo···e ··· t···wh··· s···em···e ···ge··· s··· a···he··· i···as···sp···al···un··· t···de···d ···hi···sp··· o···.2···it···im···io··· a···ra···an···el···il··· a···th···re···e ···th···af···nd···ab···op···ti···of···e ···le···st···Du···o ··· h··· t···ni··· r···ir···nt··· h··· s···da···is···t ···wa···fo···he···oc···in···nd···od···io···ec···lo···of···e ···ec··· i···lf··· t···sa···ti···it··· r···ir···to···ll···on···er···e ···ui···en···of···rv···ab···ty···d ···ia···it···n ··· i···al···io···od···el···io···f ···ct···ic···mp···nt···nd···rc··· c···tr···io···ro···s.···ed··· t···te···ol··· a···mu···io···f ···st··· d···ct···,t··· s···y ···pt···he···du··· M···ic···th···of···te···r ···t ···ac···ve···e ···er··· o···20···ws···d ···m.··· a···ic···on··· s···co···hr···h ···e ···hn···gy··· t···de···to···ni···he···ze··· p···l ···ay···d ··· d···gn··· b···-e···el···ro··· c···ui···ak···t ···t ··· t···ni··· r···ir···nt···f ···se···at··· r···lu···n ··· s···li···fr···en···Th···em···at··· f···ba···co···ol···st···of···e ···ec··· c···os···of···e ···li···fa···ea···g ···te···d ··· d···ct···te···ra···e ···so···ns···s ··· s···il··· o···he···st···an···ma···qu···ty···e ···pr···ed···ti···at···in···ra···g(···AS···s ···li···to···e ···-r···wi···bo···de···to···hi···gr···ly···du··· t···se···us···at···in···ro···m ···th···id···od···et···or···e ···ci···de···n ···de···to···at··· a···pr···ss···al···s ···dw··· r···ab···ty···d ···vi···bi···y.··· s···ia···es··· o···he···te···r ···ri···nd···du···st···tu···al···st···gt···s ··· h··· t···sf···in···e ··· d···ct···

16···性能···测器···0排···统核···件。···的临···场景···测器···、空···率和···率等···数要···的提···影1···m探···已有···、4···测器···积累···足了···测器···声、···辨率···频率···要求···模块···也为···m探···研制···基础···解决···性、···定性···务性···过程···点。···身设···D ···系统··· A···应用···20···探测···大大···宽体···自身···重的···实现···探测···有技···，保···20···系统···研发···6 ···hi···pe···rm···e ···e-···y ···ec··· i···he···re···mp···nt··· 3···sl···s ···sy···m.··· a···al···in···l ···li···io···eq···es···e ···ec··· t···mp···e ··· t···ni··· p···me···s ···h ···no···,s···ia···es···ti···an···am···ng···eq···cy···se···n ··· t···no···y ···2 ···an··· c···et···or···he··· c···et···or···lf···ed···e ···hn···l ···ui···en···of···de···dy···te···r ···lu···g ···se···at··· r···lu···n ··· s···li···fr···en···At···e ···e ···e,··· m···la···es··· h···la···a ···nd···on···r ··· d···lo···nt··· t···16··· d···ct···su···ss···ly···lv··· t···di···cu···es··· t···de···op···t ···ce···su···as···li···li···te···ra···e ···tr···st···li···an···er···ea···it···he··· a···-s···te···g ···d(···AS···es···ed···is···pl··· t···he···0 ···ce···id···et···or···ic···re···y ···uc···th···er···s ···bl···of···de···te···r.···re···ze···ll···e ···hn···l ···ui···en···of···e ···e-···y ···ec··· a···gu···nt··· t···de···op···t ···th···20···ic···CT···st···